The 2021 tech world was as busy as it has ever been, thanks to the continued challenges presented by the COVID-19 pandemic. And this is particularly true for conversational AI. From insurance to retail, businesses are doubling down on their technology investments and broader digital transformation efforts as they try to adapt to the expectations […]

The post 2022: The Dawn of Next-Gen Conversational AI? appeared first on DATAVERSITY.

TOKYO, Feb 25, 2022 - (JCN Newswire) - NEC Corporation (TSE: 6701) today announced it has enhanced its Converged Core by launching a containerized Charging Gateway Function (CGF). This new Network Function (NF) provides significant flexibility in processing increasingly complex billing information, while also enabling mobile network operators (MNOs) to efficiently launch new charging models. This new flexible billing capability frees MNOs from legacy usage-based systems and allows for monetization strategies that closely match a specific use case.

5G networks are expected to provide end-users with various types of services built on enhanced Mobile Broadband (eMBB), Massive Machine Type Communications (mMTC) and Ultra-Reliable Low Latency Communications (URLLC). While a legacy billing model, such as flat-rate or usage-based billing, may fit for eMMB services, it will become inadequate as mMTC and URLLC services come to life in the coming years. For example, a Quality of Service model would be more suitable for a URLLC, with quality guarantees with discounts based on Service Level Agreements. mMTC billings, on the other hand, should be based on the number of concurrent connections for IoT devices, such as connected home appliances.

The CGF advanced billing capability is the latest addition to a suite of solutions called NEC Open Networks. NEC is leveraging its rich history of innovation in network architecture and telecommunications to lead our industry's transition to Open RAN for 5G. NEC's broad suite of solutions in this area is second to none, featuring disaggregated RAN components, xHaul transport, Core Networks, Operations Automation and professional Systems Integration - all enhanced by cloud-native accessibility and performance. Wireless operators can rely on NEC Open Networks to realize the real-world benefits of truly open 5G networks -- flexibility, improved speed of innovation and independence from proprietary solutions while taking advantage of the global accessibility and scalability of the cloud.

"This CGF functionality prepares our customers for the increased complexity they're likely to face as networks continue to support a growing number of connected devices," said Patrick Lopez, VP of Product Management for 5G Products, NEC. "Operators can feel free to make the best business decision when rolling out new services knowing that they have creative, nimble options in capturing revenues for those services."

NEC CGF is an NF that resides between the Converged Core and the billing system, helping MNOs improve their time to market with new solutions without modifying existing billing systems. This flexibility also provides the crucial ability to tailor billing to the diversified needs and requirements of each user. In addition, the fully cloud-native, containerized architecture of NEC Converged Core NFs, now including CGF, provides 5G networks with high scalability and resiliency.

NEC will be presenting its industry leading NEC Open Networks at MWC Barcelona 2022, at Fira Gran Via, Hall 2 2F10.

https://www.nec.com/en/event/mwc2022/

About NEC Corporation

NEC Corporation has established itself as a leader in the integration of IT and network technologies while promoting the brand statement of "Orchestrating a brighter world." NEC enables businesses and communities to adapt to rapid changes taking place in both society and the market as it provides for the social values of safety, security, fairness and efficiency to promote a more sustainable world where everyone has the chance to reach their full potential. For more information, visit NEC at https://www.nec.com.


Copyright 2022 JCN Newswire. All rights reserved. www.jcnnewswire.comNEC Corporation today announced it has enhanced its Converged Core by launching a containerized Charging Gateway Function (CGF).

SUZHOU, China–(BUSINESS WIRE)–Midea Group (000333.SZ), a leading global high-technology company, today announced details of its next-gen robot vacuum cleaner, Midea’s S8+ auto-dust-collection robot, made by Midea Robozone Technology, a subsidiary of Midea Group. The S8+ joins Midea’s intelligent cleaning product line that provides optimum performance covering all household cleaning solutions. “As an innovator in smart […]

The post Midea Unveils Latest Smart Cleaning Technology and Futuristic Robot Vacuum Cleaner to the World appeared first on Fintech News.

Variants of the Mirai codebase are still a popular way to compromise and subvert Internet of Things devices, but experts fear more serious threats may be ahead.

TOKYO, Jan 12, 2022 - (JCN Newswire) - TANAKA Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka) has announced that its subsidiary, TANAKA Denshi Kogyo K.K. (Head office: Kanzaki-gun, Saga; Representative Director & President: Shigeru Iseki), which is engaged in the production of various types of bonding wires, will establish a new plant in Hangzhou City, China, for the production of aluminum bonding wires for power semiconductors. The plant is scheduled to commence operations in November of 2022.

Construction of this new plant forms part of TANAKA Denshi Kogyo's plans to increase its production capacity for aluminum bonding wires by approximately three-fold by 2025 in order to meet the growing global demand associated with the growth of power semiconductors.

TANAKA Denshi Kogyo has been producing various bonding wires and providing technical services at its subsidiary, TANAKA Electronics (Hangzhou) Co., Ltd. in China, since 2001. With the recent imbalance of global supply and demand for semiconductors resulting in a worsening shortage of semiconductors, it has been a matter of urgency to establish a stable supply system for high-quality bonding wires as an important peripheral material for the semiconductor industry. To meet the growing demand associated with the domestic production of power semiconductors in China, in particular, the new plant will be established to provide a stable supply system for aluminum bonding wires.

As a leading manufacturer of bonding wire, TANAKA Denshi Kogyo continues to contribute to the semiconductor industry by supplying countries around the world even during states of emergency.

About power semiconductors

Power semiconductors are semiconductors that control and supply power (electricity) and are used in power supplies in electronic devices, motors, and switches. They are always used in electronic devices that have power circuits and are used in a wide range of applications, from everyday home appliances, such as PCs, smartphones, and televisions, to automotive and industrial equipment.

Bonding wires for power semiconductors are required to have the capability to carry large currents in extreme conditions, and aluminum has already been used in many power device fields for its excellent bonding properties and moisture resistance.

About TANAKA Denshi Kogyo bonding wires

TANAKA Denshi Kogyo has produced various types of bonding wire since its founding more than 50 years ago, and today it boasts a leading share of the global market. After establishing its first overseas production base in Singapore in 1978, the company has constructed additional production bases in Malaysia, China, and Taiwan. It now supplies its wires to countries engaged in the production of semiconductors around the world.

Overview of the new plant
Plant name: TANAKA Electronics (Hangzhou) Co., Ltd. Jiangdong Plant
Total floor area: Approx. 11,000 m2
Description of business: Production of aluminum bonding wires
Start of operations: November 2022

Press release in PDF: https://www.acnnewswire.com/docs/files/202201_EN.pdf

TANAKA Denshi Kogyo K.K.
Headquarters: 2303-15, Yoshida, Yoshinogari-cho, Kanzaki-gun, Saga
Established: 1961
Representative: Representative Director & President: Shigeru Iseki
Capital: 1.88 billion yen
Sales: 28,259,716,000 yen (FY2020 results)
Number of employees: 819, including overseas subsidiaries, as of March 31, 2021

TANAKA Electronics (Hangzhou) Co., Ltd.
Headquarters: F1 Area, West No.19 Street, North No.10 Street, Hangzhou Economic & Technological Development Zone, Hangzhou (310018), Zhejiang
Established: 2001
Representative: Shigeru Iseki, Chairman

About TANAKA Precious Metals

Since its foundation in 1885, TANAKA Precious Metals has built a portfolio of products to support a diversified range of business uses focused on precious metals. TANAKA is a leader in Japan regarding the volumes of precious metals handled. Over the course of many years, TANAKA has not only manufactured and sold precious metal products for industry but also provided precious metals in such forms as jewelry and assets. As precious metals specialists, all Group companies in Japan and around the world collaborate and cooperate on manufacturing, sales, and technology development to offer a range of products and services. With 5,193 employees, the group's consolidated net sales for the fiscal year ending March 31, 2021, was 1,425.6 billion yen.

Global industrial business website
https://tanaka-preciousmetals.com

Product inquiries
TANAKA Kikinzoku Kogyo K.K.
https://tanaka-preciousmetals.com/en/inquiries-on-industrial-products/

Press inquiries
TANAKA Holdings Co., Ltd.
https://tanaka-preciousmetals.com/en/inquiries-for-media/

Copyright 2022 JCN Newswire. All rights reserved. www.jcnnewswire.com

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